
Software tool used for calibrating material models to experimental data, particularly for polymers, enabling accurate simulations of material behavior in finite element analysis.

Supplies coupled electro-optic, opto-thermal simulations and workflows to model optical, electrical and thermal and quantum effects at component level (CHARGE, DGTD, FEEM, HEAT, MQW and VCSEL solvers).

Simulates all metal stamping tasks through an end-to-end workflow that allows users to perform entire die process in a single platform.

Automates the creation, maintenance and QA testing of INTERCONNECT and Verilog-A photonic compact model libraries (CMLs).

Supports key safety analysis methods at various levels of a chip, ranging from IP design of integrated components up to SoCs and electronic boards.

A comprehensive library of advanced material models designed for simulating the complex mechanical behavior of polymers in finite element analysis.
For more than 50 years, Ansys software has enabled innovators across industries to push boundaries with the predictive power of simulation. From sustainable transportation and advanced semiconductors, to satellite systems and life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.