


Synopsys PrimeX is a light-weight solution for analyzing the top hierarchy of full-chip designs that are too large for most in-design tools. It provides fast, high-capacity voltage-drop and electromigration (EM/IR) analysis.

Synopsys PrimeClosure is the industry’s golden signoff ECO solution, delivering unified, multiphysics-aware optimization with signoff accuracy by construction. With native integration of PrimeTime® (STA), RedHawk-SC (EM/IR), and PrimeShield (process sensitivity), it ensures faster convergence and superior QoR.

Synopsys ParagonX delivers rapid, visual IC layout parasitics analysis and debugging, empowering design teams to identify and resolve parasitic-induced performance issues early in the design flow.

The Synopsys 3DIC Compiler platform enables efficient multi-die/advanced package co-design and optimization for 2.5D and 3D multi-die designs. In a single environment, the platform enables analysis-driven feasibility exploration, partitioning, prototyping, and floorplanning for comprehensive full-stack designs.

Synopsys Euclide IDE simplifies RTL code writing, provides real-time bug detection, and optimizes code for design and verification flows in SystemVerilog and UVM development.

Synopsys RedHawk-SC Electrothermal delivers multiphysics signoff for multi-die (2.5/3DIC) systems, integrating power integrity, signal integrity, thermal integrity, and structural integrity in a unified platform.

Synopsys VSO.ai™ (Verification Space Optimization) delivers the industry’s first AI-driven verification solution to help verification teams achieve coverage closure faster and with higher quality. The system works autonomously to reach coverage targets as quickly and as cheaply as possible.

The SiliconSmart® solution is part of the Synopsys Custom Design Platform and generates Liberty libraries for use in digital design and implementation flows.

Synopsys helps customers innovate from Silicon to Software, so they can deliver Smart, Secure Everything